Immersion Gold is by the method of chemical oxidation-reduction reaction, then to generate a layer of nickel alloy or a copper pad on the gold thickness generated by this way is thicker than gold plating, and is using a deposition way to achieve the gold layer thickness, we usually called it as immersion gold.
Hongmy Circuit is a professional manufacturer which specializes in customized printed circuit board(PCB).
1. According to layer number: Singe/Double side PCB, Multilayer PCB,
2. According to material: FR-4, Aluminium, and Rogers PCB
3. According to surface finishing: HASL Lead PCB, HASL Lead free PCB, Immersion Gold
PCB,ENIG PCB, OSP finishing PCB, Immersion Tin PCB, Immersion Silver PCB, Gold Finger PCB, Tin panel PCB, Gold-plated PCB
4. According to special requirements: Heavy copper PCB, Impedance control PCB, Carbon treated PCB, Peelable Mask PCB, No X-OUT PCB, High Tg PCB, Tg170 PCB, Tg150 PCB, Tg130 PCB, Blind Vias PCB, Burid Vias PCB, BGA PCB,
5.Hongmy's work:. PCB OEM&ODM Clone/Copy Service
6.What certificates we have: ISO 9001:2008, UL Certificates, RoHS and SGS testing report
7.Packaging Way: Pack PCB with vacuum plastic and carton
8.Delivery Way: Express way: DHL/UPS/Fedex/TNT/Aramex, By Air, By Sea. All choosing by you.
The difference between gold and gold plating sink PCB multi-layer circuit board
1. Different crystal structure of the nickel alloy - gold is much thicker than gold plating on the surface, the color tends to be more yellow gold, many look beautiful, more satisfied customers. Compare whitened gold plating, gold is not so yellow.
2. Different application on elelctruc welding-due to the different crystal structure, Shen metallurgical gold is easier for electric welding, and gold-plate stress easier to control.
3. Different density-Immersion Gold board more dense than gold-plated board, more antioxidant helps to protect circuit boards and copper.
4. Different stability-more sophisticated circuit boards, usually around 3mil board with Immersion Gold process is more prone to nickel and gold on the pad, without causing short circuits.
5. Different smoothness-Immersion Gold sheet metal on the pad is very smooth, this is for BGA soldering, welding or some high requirements pad is very necessary process.
But immersion gold process arising from nickel-gold due to the different crystal structures of the nickel layer of relatively soft gold, unlike gold plating so hard, so not suitable for use Immersion Gold Goldfinger process and selection of gold, because gold gilt over heavy resistance mill.