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Capability:

Item

Manufacture Capbility

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-1/ Aluminum

Layer No.

1-16

Board thickness

Base Material Thickness

0.2 mm-3.0 mm

Finished Board thickness

0.2 mm-3.2mm(8 mil-126 mil)

Board Thickness Tolerance

±10%(>=1.0 mm); ± 0.1mm(<=1.0 mm)

Cooper thickness

0.5 OZ-6 OZ (18 um-210um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp & Twist

0.75%

Peelable

0.3mm-0.5mm

Images

Min Trace Width (a)

0.1 mm (4 mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.2mm (8 mil)

SMD Pitch (a)

0.3 mm(12 mil)

BGA Pitch (b)

0.3 mm (12 mil)

Holes

Min Hole size (CNC)

0.2 mm (8 mil) (Better bigger than 0.25 mm)

Min Punch Hole Size

0.9 mm (35 mil)

Hole Size Tol (+/-)

PTH:±0.075 mm; NPTH: ±0.05 mm, Punch hole Tol: ±0.15 mm

Hole Position Tol

±0.075mm

Min Slots Width

0.6 mm

Plating

Lead HASL

2.5 um

Lead free HASL

2.5 um

Immersion Gold

Ni:7um  Au: 1-5u''

OSP

0.2-0.5um

Silkscreen

Width

Min 0.13 mm

Height

Min 0.8 mm

Space(to pads or holes)

Min 0.16 mm

Outline

Panel Outline Tol (+/-)

CNC: ±0.1mm, Punching: ±0.075mm

Beveling

20°, 30°, 45°,60°+/- 5°

Gold Finger angle

30° , 45° , 60°

Color

Solder Mask

Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue, etc.

Silkscreen

White, Black, Blue, Black,Yellow, etc.

Certificate

ROHS, ISO9001:2008, SGS, UL certificate.